research-article

Non-uniform micro-channel design for stacked 3D-ICs

Authors:

Bing Shi,

Ankur Srivastava,

Peng WangAuthors Info & Claims

DAC '11: Proceedings of the 48th Design Automation Conference

Pages 658 - 663

https://doi.org/10.1145/2024724.2024874

Published: 05 June 2011 Publication History

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Abstract

Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with micro-channels. This approach, though might provide sufficient cooling, requires quite high pumping power. In this paper, we investigate the non-uniform allocation of micro-channels to provide sufficient cooling with less pumping power. Specifically, we decide the count, location and pumping pressure drop/flow rate of micro-channels such that acceptable cooling is achieved at minimum pumping power. Thermal wake effect and runtime pressure drop/flow rate control are also considered. The experiments showed that, compared with the conventional design which spreads micro-channels all over the chip, our non-uniform microchannel design achieves 55--60% pumping power saving.

References

[1]

M. S. Bakir, C. King, and et al. 3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation. In IEEE 2008 Custom Intergrated Circuits Conference, pages 663--670, 2008.

Crossref

Google Scholar

[2]

A. K. Coskun, J. L. Ayala, D. Atienzaz, and T. S. Rosing. Modelingand dynamic management of 3D multicore systems with liquid cooling. In 17th Annual IFIP/IEEE International Conference on Very Large Scale Integration, pages 60--65, 2009.

Google Scholar

[3]

G. Hamerly, E. Perelman, J. Lau, and B. Calder. Simpoint 3.0: Faster and more flexible program analysis. In Journal of Instruction Level Parallelism, 2005.

Google Scholar

[4]

Y. J. Kim, Y. K. Joshi, A. G. Fedorov, Y. J. Lee, and S. K. Lim. Thermal characterization of interlayer microfluidic cooling of three dimensional integrated circuits with nonuniform heat flux. ASME Trans. Journel of Heat Transfer, 2010.

Google Scholar

[5]

R. W. Knight, D. J. Hall, and et al. Heat sink optimization with application to microchannels. IEEE Trans. on Components, Hybrids, and Manufacturing Technology, pages 832--842, 1992.

Google Scholar

[6]

J.-M. Koo, S. Im, L. Jiang, and K. E. Goodson. Integrated microchannel cooling for three-dimensional electronic circuit architectures. ASME Trans. Journel of Heat Transfer, pages 49--58, 2005.

Crossref

Google Scholar

[7]

Y.-J. Lee and S. K. Lim. Co-optimization of signal, power, and thermal distribution networks for 3D ICs. In Electrical Design of Advanced Packaging and Systems Symposium, pages 163--155, 2008.

Google Scholar

[8]

H. Mizunuma, C. L. Yang, and Y. C. Lu. Thermal modeling for 3D-ICs with integrated microchannel cooling. In IEEE/ACM Intl. Conf. on Computer Aided Design, pages 256--263, 2009.

Digital Library

Google Scholar

[9]

K. Skadron, M. R. Stan, K. Sankaranarayanan, W. Huang, S. Velusamy, and D. Tarjan. Temperature-aware microarchitecture: Modeling and implementation. ACM Trans. on Architecture and Code Optimization, 1(1):94--125, 3.

Digital Library

Google Scholar

[10]

D. B. Tuckerman and R. F. W. Pease. High-performance heat sinking for VLSI. IEEE Electron Device Letters, pages 126--129, 1981.

Crossref

Google Scholar

[11]

Y. Zhang, A. Srivastava, and M. Zahran. Chip level thermal profile estimation using on-chip temperature sensors. In IEEE International Conference on Computer Design, pages 432--437, 2008.

Google Scholar

Cited By

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Song DDong GYao YZhu ZYang Y(2022)Optimization and Analysis of Microchannels Under Complex Power Distribution in 3-D ICsIEEE Transactions on Components, Packaging and Manufacturing Technology10.1109/TCPMT.2022.315514812:3(537-543)Online publication date: Mar-2022
https://doi.org/10.1109/TCPMT.2022.3155148
Salvi SJain A(2021)A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)IEEE Transactions on Components, Packaging and Manufacturing Technology10.1109/TCPMT.2021.306403011:5(802-821)Online publication date: May-2021
https://doi.org/10.1109/TCPMT.2021.3064030
Al Siyabi IKhanna SSundaram SMallick T(2018)Experimental and Numerical Thermal Analysis of Multi-Layered Microchannel Heat Sink for Concentrating Photovoltaic ApplicationEnergies10.3390/en1201012212:1(122)Online publication date: 30-Dec-2018
https://doi.org/10.3390/en12010122
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Index Terms

Non-uniform micro-channel design for stacked 3D-ICs
1. Hardware
  1. Electronic design automation
    1. Physical design (EDA)

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Information & Contributors

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Published In

DAC '11: Proceedings of the 48th Design Automation Conference

June 2011

1055 pages

ISBN:9781450306362

DOI:10.1145/2024724

General Chair:
Leon Stok
IBM Corp., Hopewell Jct., NY
,
Program Chairs:
Nikil Dutt
Univ. of California, Irvine, CA
,
Soha Hassoun
Tufts Univ., Medford, MA

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 05 June 2011

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Research-article

Funding Sources

Division of Computing and Communication Foundations

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DAC '11

Sponsor:

EDAC
SIGDA

DAC '11: The 48th Annual Design Automation Conference 2011

June 5 - 10, 2011

California, San Diego

Acceptance Rates

Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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DAC '25

Sponsor:
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62nd ACM/IEEE Design Automation Conference

June 22 - 26, 2025

San Francisco , CA , USA

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Cited By

View all

Song DDong GYao YZhu ZYang Y(2022)Optimization and Analysis of Microchannels Under Complex Power Distribution in 3-D ICsIEEE Transactions on Components, Packaging and Manufacturing Technology10.1109/TCPMT.2022.315514812:3(537-543)Online publication date: Mar-2022
https://doi.org/10.1109/TCPMT.2022.3155148
Salvi SJain A(2021)A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)IEEE Transactions on Components, Packaging and Manufacturing Technology10.1109/TCPMT.2021.306403011:5(802-821)Online publication date: May-2021
https://doi.org/10.1109/TCPMT.2021.3064030
Al Siyabi IKhanna SSundaram SMallick T(2018)Experimental and Numerical Thermal Analysis of Multi-Layered Microchannel Heat Sink for Concentrating Photovoltaic ApplicationEnergies10.3390/en1201012212:1(122)Online publication date: 30-Dec-2018
https://doi.org/10.3390/en12010122
Yang ZZuzak MSrivastava AJacob B(2018)HMCThermProceedings of the International Symposium on Memory Systems10.1145/3240302.3240319(209-117)Online publication date: 1-Oct-2018
https://dl.acm.org/doi/10.1145/3240302.3240319
Lee DDas SDoppa JPande PChakrabarty K(2018)Performance and Thermal Tradeoffs for Energy-Efficient Monolithic 3D Network-on-ChipACM Transactions on Design Automation of Electronic Systems10.1145/322304623:5(1-25)Online publication date: 22-Aug-2018
https://dl.acm.org/doi/10.1145/3223046
Zhu HHu FZhou HPan DZhou DZeng X(2018)Interlayer Cooling Network Design for High-Performance 3D ICs Using Channel Patterning and PruningIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2017.273168337:4(770-781)Online publication date: 1-Apr-2018
https://dl.acm.org/doi/10.1109/TCAD.2017.2731683
Lee DDas SPande P(2018)Analyzing power-thermal-performance trade-offs in a high-performance 3D NoC architectureIntegration10.1016/j.vlsi.2017.12.002Online publication date: Mar-2018
https://doi.org/10.1016/j.vlsi.2017.12.002
Joshi YWan Z(2018)Single- and Multiphase Flow for Electronic CoolingHandbook of Thermal Science and Engineering10.1007/978-3-319-26695-4_49(1973-2029)Online publication date: 27-Jun-2018
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Serafy CYang ZSrivastava ABehjat LHan JVelev MChen D(2017)Design Space Modeling and Simulation for Physically Constrained 3D CPUsProceedings of the Great Lakes Symposium on VLSI 201710.1145/3060403.3060499(375-380)Online publication date: 10-May-2017
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Lu TSerafy CYang ZSamal SLim SSrivastava A(2017)TSV-Based 3-D ICs: Design Methods and ToolsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2017.266660436:10(1593-1619)Online publication date: Oct-2017
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