Article

Placement of 3D ICs with thermal and interlayer via considerations

Authors:

Sachin SpatnekarAuthors Info & Claims

DAC '07: Proceedings of the 44th annual Design Automation Conference

Pages 626 - 631

https://doi.org/10.1145/1278480.1278637

Published: 04 June 2007 Publication History

Abstract

Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during global and detailed placement. Analytical and partitioning-based techniques are developed to explore the tradeoff between wirelength, interlayer via counts, and thermal effects. This method allows wirelengths to be minimized for any desired interlayer via density and temperatures to be reduced while minimizing deleterious effects on wirelength and interlayer via counts. Wirelength reductions within 2% of the optimal can be achieved using 46% fewer interlayer vias. Temperatures can be reduced by about 20% with only 1% higher wirelengths and 10% more interlayer vias.

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Index Terms

Placement of 3D ICs with thermal and interlayer via considerations
1. Hardware
  1. Electronic design automation
    1. Physical design (EDA)
      1. Placement
      2. Wire routing
  2. Emerging technologies

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cover image ACM Conferences

DAC '07: Proceedings of the 44th annual Design Automation Conference

June 2007

1016 pages

ISBN:9781595936271

DOI:10.1145/1278480

General Chair:
Steven P. Levitan
Univ. of Pittsburgh, Pittsburgh, PA

Copyright © 2007 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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SIGDA: ACM Special Interest Group on Design Automation

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Association for Computing Machinery

New York, NY, United States

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Published: 04 June 2007

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DAC07: The 44th Annual Design Automation Conference 2007

June 4 - 8, 2007

California, San Diego

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DAC '07 Paper Acceptance Rate 152 of 659 submissions, 23%;

Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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https://doi.org/10.1109/TCAD.2023.3347293
Pei SXie KWang XXie GLi KLi WLi YWen J(2022)BBF: A Bloom Filter Using B Sequences for Multi-set Membership QueryACM Transactions on Knowledge Discovery from Data10.1145/350273516:5(1-26)Online publication date: 9-Mar-2022
https://dl.acm.org/doi/10.1145/3502735
Chen WZheng JYu HChen GChen YLi D(2022)Online Learning Bipartite Matching with Non-stationary DistributionsACM Transactions on Knowledge Discovery from Data10.1145/350273416:5(1-22)Online publication date: 9-Mar-2022
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