Choosing the right grade of SSD for your enterprise applications requires an understanding of the differences between various NAND technologies. This whitepaper explains the fundamental characteristics of 2-bit-per-cell MLC and 3-bit TLC NAND types, as well as the inherent scaling limitations of planar NAND and how vertical NAND (V-NAND) technology solves these issues with an innovative vertical structure.
2. Enterprise applications have
become much more versatile
within the past decade, due to
the rise of Internet-connected
devices such as smartphones
and tablets. As the amount of
data that are generated every
day is growing and devices are
shifting away from high-capacity
local storage to cloud storage,
the requirements for enterprise
storage are changing and cost
considerations are becoming
more critical.
Today, there are numerous
classes of enterprise solid
state drives (SSDs) for different
applications, each with unique
performance and endurance
characteristics. One of the most
critical differentiators is the
underlying NAND technology,
which has been developing
rapidly in the past decade with
new innovations such as Multi-
Level Cell (MLC) and Vertical
NAND (V-NAND) technologies.
Choosing the right SSD for the
application is not necessarily an
easy task given the complexity
of the differences between
various NAND technologies.
This whitepaper explains the
fundamental characteristics of
two-bit-per-cell (MLC) and three-
bit-per-cell (3-bit MLC or TLC)
NAND technologies, as well as
the inherent scaling limitations of
planar NAND and how vertical
NAND (V-NAND) technology
solves these issues with our
innovative vertical structure.
Understanding the basics
of NAND is the key to
understanding performance,
endurance and cost differences
between SSDs, which is
essential for making an educated
purchase for your specific
enterprise application.
When NAND was invented in the
late 1980s, it was only capable
of storing one bit per cell. It
took nearly two decades of
engineering work before the first
SSD based on MLC NAND with
two bits per cell was introduced
by Samsung in 2007. Ever since
then, the industry has been
moving more and more towards
MLC technology and today,
SLC only accounts for a few
per cents of total NAND flash
output. Recently, triple-level-cell
(3-bit MLC) NAND has also been
gaining popularity, with Samsung
being the first manufacturer to
introduce it to its client SSDs in
2012 and to enterprise SSDs
two years later.
The SSD and NAND industries
have been adopting multi-
level cell technology due to the
increased cost efficiency. NAND
cost is dictated primarily by
the number of gigabytes each
wafer yields and historically there
have been two ways to achieve
increases. The first is to shrink
individual cells through traditional
lithography and multi-patterning
technologies. By making each
cell smaller, it’s possible to fit
more cells in a wafer, which
yields more gigabytes and thus
reduces the manufacturing
cost of each gigabyte. The
whole semiconductor industry
relies on lithography shrinks
to either provide lower cost
by reducing the die size, or by
adding more transistors per
die to deliver more functionality
or higher performance. While
lithography is the cornerstone
of semiconductor scaling, it has
become less cost effective in
recent years.
The second way is to add more
bits per cell. NAND flash works
by trapping electrons in an
insulated floating gate, which
creates a charge inside the cell.
SLC NAND cells only have two
states: charged (0) and non-
charged (1), whereas 2-bit MLC
NAND has four and 3-bit MLC
NAND eight to differentiate all the
possible bit outputs that two or
three bits can have.
Evaluating MLC vs TLC vs V-NAND
History of Multi-Level Cell NAND Flash
EMC Digital Universe Study, IDC
The Digital Universe by 2020
Zettabytes
of Data
44
3. Both cost scaling methods
have a negative impact on the
endurance and performance
of NAND. Making cells smaller
reduces the number of available
electrons that can be used to
differentiate between voltage
states and additionally, by
bringing cells closer to each
other and thinning the insulators
around the floating gate, the
cells become more vulnerable
to interference from neighboring
cells.
As NAND goes through program
and erase (P/E) cycles, the
tunnel oxide wears out due to
the stress caused by the strong
electric field, which is required
to tunnel electrons through the
insulating oxide to the floating
gate. This generates holes
inside the oxide structure, which
act as escape paths for the
electrons in the floating gate.
Electrons may also get trapped
in the holes during the tunneling
process. Because NAND flash
differentiates bit values based
on the voltage state of the
floating gate, electron leakage
and trapping may alter the state
from the correct one, making
the cell unreliable.
Increasing the number of bits
per cell makes matters worse
because 3-bit MLC NAND
needs to differentiate between
eight voltage states, while MLC
NAND has only four. That makes
3-bit MLC NAND less tolerant
against cell-to-cell interference
and electron leakage/
trapping, because it takes less
interference and fewer electrons
to change the state of a cell.
Similarly, 3-bit MLC NAND
requires more program-verify
iterations than MLC NAND,
as every bit is programmed
separately and the voltage
distribution of each state is
much finer, requiring a very
specific number of electrons in
the floating gate.
This all leads to 3-bit MLC
NAND having lower write
endurance and performance
compared to MLC NAND,
but read endurance and
performance are barely affected.
Because reading from NAND
works by simply sensing
the charge in the cell, the
read performance difference
between MLC and 3-bit MLC
is practically negligible in real-
world applications. Similarly,
as reading doesn’t involve a
stressful electron tunneling
process, reads induce
substantially less strain on
cells. Whereas write cycles are
measured in thousands or tens
of thousands, read cycles run
in hundreds of millions even for
3-bit MLC NAND.
The Downsides of NAND Flash Cost Scaling
1 0
11 10 01 00
Single Level Cell (SLC) NAND
NAND Flash Types
Multi Level Cell (MLC) NAND
Tri Level Cell (TLC) NAND
000 001 010 011 100 101 110 111
4. As explained above, NAND has
traditionally been scaled by
shrinking the lithography, and in
the past decade, multiple bits
per cell have been introduced
to further scale the cost
down, but both methods are
now starting to become less
effective. These methods are
actually counteractive because
as cell size and the number of
electrons scale down, storing
multiple bits per cell becomes
even more difficult and creates
serious endurance and reliability
concerns.
To continue cost scaling in
the future, semiconductor
manufacturer have introduced
3D or Vertical NAND, stacking
multiple cells in layers. Samsung
was the first manufacturer to
begin production of its V-NAND
in 2013, with the first V-NAND-
based SSDs released a year
later.
V-NAND works by stacking
multiple layers in order to create
“cell towers.” Scaling to the
third dimension takes away
the lithography stress because
instead of making cells smaller,
cost reduction can be achieved
by increasing the number of
layers. Samsung is currently
shipping its second generation
32-layer V-NAND, and third
generation 48-layer V-NAND is
going into production in October
2015.
Because the high number of
layers brings considerable
density improvement, the cells
don’t have to be packed as
closely. Samsung has actually
moved to much larger 30nm-
class lithography, whereas
modern planar NAND is
manufactured using 15-20nm
lithography. As cells are larger
with more available electrons
and distance between cells
is greater, V-NAND is able to
provide tremendous endurance
and performance gains over
planar NAND.
V-NAND: Enter the Third Dimension of Scaling
Cell to cell interference
occurs under 20nm
2D Planar NAND Flash
30nm
Vertical NAND Flash
2.5 billion holes in
an area the size
of a fingertip
32ormorelayers
10nm
Transforming NAND in an Upward Direction
For more details about
V-NAND and how it differs
from planar NAND, please
refer to this Samsung
V-NAND technology
whitepaper.
LEARN MORE
5. For the majority of client
applications, 3-bit MLC NAND
provides the necessary write
endurance and performance
because consumers do not
usually write more than 20
gigabytes of data per day and
disk activity is based on bursts
of IOs. However, enterprise IO
workloads are more complicated
because there are many different
applications, each with unique
characteristics. Enterprise
workloads can, however, be
roughly divided into categories
by their write-intensity.
Read-centric workloads
include applications such
as cloud storage, media
streaming and web servers.
In these applications, data is
written once but is rarely, if
ever, modified, yet it may be
accessed by millions of people.
3-bit MLC NAND is perfect for
such applications because it
offers read performance very
similar to MLC NAND, but at a
substantially lower cost. Many
read-intensive applications
require very large amounts of
storage (consider Netflix and
Facebook as examples), but
as the data is mostly read-only,
the applications do not usually
need more than one drive write
per day (DWPD) in endurance,
making 3-bit MLC an ideal
choice because of its lower
cost.
For mixed workloads, the
choice of NAND depends on
the amount of write activity.
Because V-NAND technology
offers much higher endurance
over planar NAND, 3-bit MLC
V-NAND can be used for
mixed workloads with low
write endurance needs –
1 DWPD or less. For example,
desktop virtualization (VDI) is
typically not very write-intensive
in office environments, and
3-bit MLC V-NAND can meet
the endurance needs for such
workloads.
On the other hand, applications
such as online analytical
processing (OLAP) tend to
require higher endurance
than 1 DWPD and are hence
best served by MLC V-NAND,
which can scale to up to 10
DWPD with configurable over-
provisioning offered in the
Samsung SM863 Series.
Use cases such as real-time
financial trading and online
transaction processing are
great examples of very write-
intensive and performance-
sensitive applications. Because
these applications generate
a lot of write IOs and even a
millisecond of additional latency
may result in a lost trade or sale,
the higher endurance and write
performance of MLC V-NAND
is required for such critical
applications.
In most enterprise workloads,
the path to the lowest total cost
of ownership (TCO) is to utilize
the benefits of both 3-bit MLC
and MLC technologies through
tiering. Files that have a lot of
write activity can be kept in the
more durable MLC-based SSDs,
while files that are read-only or
accessed more infrequently can
be moved to a lower tier that is
based on 3-bit MLC SSDs.
Choosing the Right NAND for Enterprise Applications
Content Delivery
Network
Drive writes
per day
Application
Workload
Suitable
NAND Type
Web
Server
Application
Server
Database
Server
0.35 DWPD 10 DWPD
3 bit 2 bit
Read-intensive Write-intensive
Mixed Pattern