零耗材、免维护、安全环保更可靠;高速、高效、高精准;主要应用于各种塑胶、玻璃、液晶屏、薄片陶瓷、硅片、IC晶粒、蓝宝石、聚合物薄膜等材料。
Zero consumables,maintenance-free, safety and environmental protection are more reliable;high speed, high efficiency, high precision; mainly used in various plastic, glass, LCD screen, thin ceramic, silicon wafer, IC grain, sapphire, polymer film and other materials.
工艺属性:镭雕打标、表面处理、剥涂层、薄板切割和打孔等等。
Process properties: radium carving, surface treatment, peeling, plate cutting, etc.
设备型号 unit type |
LW-UV |
|
激光功率 laser power |
3W/5W/8W/10W |
激光波长 laser wave length |
355nm |
脉冲宽度 pulse length |
<15ns@40kHz |
|
频率范围 frequency |
10-200khz |
光束直径 beam diameter |
0.7±0.1mm |
|
偏振方向 Polarization direction |
Horizontal |
M? |
≤ 1.2 |
|
标记范围 Marking Range |
110mm*110mm (可选配) Optional |
打标速度 Bidding speed |
≤10000mm/s |
|
输出模式 Output mode |
TEMoo |
打标软件 Bidding software |
北京金橙子 Beijing Golden Orange |
|
储存温度 storage temperature |
-20-65°C |
温度范围 temperature range |
10-35°C |
|
光斑圆度 Beam Circularity |
>90% |
工作电源 working power supply |
220V/50Hz/3A |
|
冷却方式 cooling-down method |
水冷 hydrocooling |
整机功率 Complete power |
≥800W |
|
设备重量 weight |
150kg |
设备尺寸 Size |
60cm*65cm*140cm |
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