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Unlocking the true potential of 3D CPUs with micro-fluidic cooling

Authors:

Caleb Serafy,

Ankur Srivastava,

Donald YeungAuthors Info & Claims

ISLPED '14: Proceedings of the 2014 international symposium on Low power electronics and design

Pages 323 - 326

https://doi.org/10.1145/2627369.2627666

Published: 11 August 2014 Publication History

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Abstract

As technology scaling is coming to an end, 3D integration is a promising technology to continue transistor density scaling in the future and facilitate new architectural designs. However heat removal is a serious chalenge in 3D ICs. A promising solution is micro-fluidic (MF) cooling. In this paper we argue that aggressive cooling methods are necessary to unlock the true potential of 3D ICs. We simulate a spectrum of 3D CPU architectures which offer vast improvements to performance, but are inefficient and thermally infeasible with air cooling alone. Our results show that integrating micro-fluidic cooling can increase average performance by 2.62x and energy efficiency by 1.78x by unlocking new architectural configurations.

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Cited By

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Ramesh Korasikha NKarthikeya Sharma TAmba Prasad Rao GMadhu Murthy K(2021)Recent Advancements in Thermal Performance Enhancement in Microchannel Heatsinks for Electronic Cooling ApplicationElectronics Cooling [Working Title]10.5772/intechopen.97087Online publication date: 20-Apr-2021
https://doi.org/10.5772/intechopen.97087
Ramesh KSharma TRao G(2020)Latest Advancements in Heat Transfer Enhancement in the Micro-channel Heat Sinks: A ReviewArchives of Computational Methods in Engineering10.1007/s11831-020-09495-1Online publication date: 16-Sep-2020
https://doi.org/10.1007/s11831-020-09495-1
Serafy CYang ZSrivastava ABehjat LHan JVelev MChen D(2017)Design Space Modeling and Simulation for Physically Constrained 3D CPUsProceedings of the on Great Lakes Symposium on VLSI 201710.1145/3060403.3060499(375-380)Online publication date: 10-May-2017
https://dl.acm.org/doi/10.1145/3060403.3060499
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Index Terms

Unlocking the true potential of 3D CPUs with micro-fluidic cooling
1. Hardware
  1. Hardware validation

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Published In

ISLPED '14: Proceedings of the 2014 international symposium on Low power electronics and design

August 2014

398 pages

ISBN:9781450329750

DOI:10.1145/2627369

General Chairs:
Yuan Xie
UCSB, USA
,
Tanay Karnik
Intel, USA
,
Program Chairs:
Muhammad M. Khellah
Intel, USA
,
Renu Mehra
Synopsys, USA

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than the author(s) must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected].

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Association for Computing Machinery

New York, NY, United States

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Published: 11 August 2014

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ISLPED'14: International Symposium on Low Power Electronics and Design

August 11 - 13, 2014

California, La Jolla, USA

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ISLPED '14 Paper Acceptance Rate 63 of 184 submissions, 34%;

Overall Acceptance Rate 398 of 1,159 submissions, 34%

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Ramesh Korasikha NKarthikeya Sharma TAmba Prasad Rao GMadhu Murthy K(2021)Recent Advancements in Thermal Performance Enhancement in Microchannel Heatsinks for Electronic Cooling ApplicationElectronics Cooling [Working Title]10.5772/intechopen.97087Online publication date: 20-Apr-2021
https://doi.org/10.5772/intechopen.97087
Ramesh KSharma TRao G(2020)Latest Advancements in Heat Transfer Enhancement in the Micro-channel Heat Sinks: A ReviewArchives of Computational Methods in Engineering10.1007/s11831-020-09495-1Online publication date: 16-Sep-2020
https://doi.org/10.1007/s11831-020-09495-1
Serafy CYang ZSrivastava ABehjat LHan JVelev MChen D(2017)Design Space Modeling and Simulation for Physically Constrained 3D CPUsProceedings of the on Great Lakes Symposium on VLSI 201710.1145/3060403.3060499(375-380)Online publication date: 10-May-2017
https://dl.acm.org/doi/10.1145/3060403.3060499
Lu TSerafy CYang ZSamal SLim SSrivastava A(2017)TSV-Based 3-D ICs: Design Methods and ToolsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2017.266660436:10(1593-1619)Online publication date: Oct-2017
https://doi.org/10.1109/TCAD.2017.2666604
Lu TSerafy CYang ZSrivastava A(2016)Voltage Noise Induced DRAM Soft Error Reduction Technique for 3D-CPUsProceedings of the 2016 International Symposium on Low Power Electronics and Design10.1145/2934583.2934589(82-87)Online publication date: 8-Aug-2016
https://dl.acm.org/doi/10.1145/2934583.2934589
Serafy CBar-Cohen ASrivastava AYeung D(2016)Unlocking the True Potential of 3-D CPUs With Microfluidic CoolingIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2015.245019224:4(1515-1523)Online publication date: Apr-2016
https://doi.org/10.1109/TVLSI.2015.2450192
Xie YBao CSerafy CLu TSrivastava ATehranipoor M(2016)Security and Vulnerability Implications of 3D ICsIEEE Transactions on Multi-Scale Computing Systems10.1109/TMSCS.2016.25504602:2(108-122)Online publication date: 1-Apr-2016
https://doi.org/10.1109/TMSCS.2016.2550460
Serafy CYang ZSrivastava AHu YJoshi Y(2016)Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin HeatsinksIEEE Design & Test10.1109/MDAT.2015.248071033:2(40-48)Online publication date: Apr-2016
https://doi.org/10.1109/MDAT.2015.2480710
Tang YWang LDeng YNi XDou Q(2016)The Macro-DSE for HPC Processing Unit: The Physical Constraints PerspectiveGreen, Pervasive, and Cloud Computing10.1007/978-3-319-39077-2_7(99-112)Online publication date: 3-May-2016
https://doi.org/10.1007/978-3-319-39077-2_7

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Physical Design of 3D FPGAs Embedded with Micro-channel-based Fluidic Cooling

Non-uniform micro-channel design for stacked 3D-ICs

Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs

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Physical Design of 3D FPGAs Embedded with Micro-channel-based Fluidic Cooling

Non-uniform micro-channel design for stacked 3D-ICs

Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs

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