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Process equipment modeling: making optimal design decisions for next generation dispensing tools

Published: 07 December 2003 Publication History

Abstract

The competitive environment faced by semiconductor equipment suppliers leaves no room for error when designing next generation tools. In addition, time to market, footprint, and equipment capabilities are all key to a successful product. At Cookson Electronics Equipment, tool designers used simulation to answer some difficult design questions, improve time to market, and lower development costs. This paper explains how simulation was used in designing the new High Volume Batch (HVB) dispensing platform. It also discusses the flexible simulation model and simulation results for various prototype equipment designs.

References

[1]
Hendrickson, R, 2000. "Using Emulation to Validate a Cluster Tool Simulation Model." In Proceedings of the 2000 Winter Simulation Conference.
[2]
Pare, K. 2002. "Using Simulation to Understand and Improve Process Tool Efficiency." In Proceedings of the MASM 2002.
[3]
Pool, Mark. 1994. "The Simulation of Cluster Tools: A New Semiconductor Manufacturing Technology." In Proceedings of the 1994 Winter Simulation Conference.

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Published In

cover image ACM Conferences
WSC '03: Proceedings of the 35th conference on Winter simulation: driving innovation
December 2003
2094 pages
ISBN:0780381327

Sponsors

  • IIE: Institute of Industrial Engineers
  • INFORMS/CS: Institute for Operations Research and the Management Sciences/College on Simulation
  • ASA: American Statistical Association
  • ACM: Association for Computing Machinery
  • SIGSIM: ACM Special Interest Group on Simulation and Modeling
  • IEEE/CS: Institute of Electrical and Electronics Engineers/Computer Society
  • NIST: National Institute of Standards and Technology
  • (SCS): The Society for Modeling and Simulation International
  • IEEE/SMCS: Institute of Electrical and Electronics Engineers/Systems, Man, and Cybernetics Society

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Winter Simulation Conference

Publication History

Published: 07 December 2003

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WSC03
Sponsor:
  • IIE
  • INFORMS/CS
  • ASA
  • ACM
  • SIGSIM
  • IEEE/CS
  • NIST
  • (SCS)
  • IEEE/SMCS
WSC03: Winter Simulation Conference 2003
December 7 - 10, 2003
Louisiana, New Orleans

Acceptance Rates

WSC '03 Paper Acceptance Rate 128 of 189 submissions, 68%;
Overall Acceptance Rate 3,413 of 5,075 submissions, 67%

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