DFI UT-X58-T3eH8 gonna get it????

Source: http://www.atomicmpc.com.au/Review/129836,dfi-ut-x58-t3eh8.aspx

AMD have officially announced the Athlon X2 7000 series processors

AMD today announced the AMD Athlon™ X2 7000 series processors, energy efficient dual-core CPUs designed for a growing segment of value-conscious PC consumers seeking a full-featured product with best-in-class performance for the changing face of everyday computing. Based on the “Stars” AMD processor architecture, the new series features AMD Balanced Smart Cache, designed to make traditional PC activities and media software work simultaneously resulting in advanced multi-tasking capabilities and exceptional multimedia performance.

Given the current economic environment, consumers are seeking the best computing value without sacrificing the performance required to maintain their digital lifestyle. This is an optimal time for system builders and PC OEMs to offer dual-core powered desktop systems that are affordable, energy efficient and help consumers get the most computing performance for their money.

The following AMD Athlon X2 7000 series processors are expected to be available from AMD’s leading channel providers:

The AMD Athlon X2 7550
The AMD Athlon X2 7750 Black Edition

http://www.tweak.dk/nyheder2.php?id=18806

Intel goes 32nm

Not just for AMD any more...

Intel is starting to talk about 32nm, and it is as it should be, with one big exception. While everyone focuses on the rather pedestrian bleeding edge headline, they missed the part about immersion.

The main thing that everyone seems to be interested in is that Intel made an announcement about 32nm chips. They scaled features linearly by .7x, so area goes down by about 50 per cent. Transistor gate pitch is 112.5nm, the smallest reported to date for any 32nm technology.

They demoed this as early as September 2007 with a 291 Mb SRAM chip. It has a .171µm^2 cell size, and used more than 1.9 Billion transistors. To put that in perspective, it is almost one transistor for every $350 given to banks in the recent 'bailout'. Talk about big numbers...

The new transistors use a second generation high-K + metal gate structure, the first generation was on 45nm.

This means chips made on the process should have low power use and leakage will be far less of a problem than without. If you are thinking evolutionary, you would be right so far. The big bang was quite well hidden though. If you read the papers that they are going to present at IEDM, you will see that they have a special feature, immersion. The paper, "A 32nm Logic Technology Featuring Second Generation High-k + Metal Gate Transistors, Enhanced Channel Strain and 0.171um2 SRAM Cell Size in a 291Mb Array" has it in the abstract. It says, "193nm immersion lithography for critical patterning layers". That more than anything is the big bang from a technology point of view.

The next step is EUV for 22nm. We are not supposed to have figured that out yet, but since they are openly posting jobs for EUV mask makers at the 22nm node, we kind of put 2 and 2 together to get 22. Cymer says they will be there in time, so things are going to get interesting and quite expensive in 3 years time.

Source http://www.atomicmpc.com.au/News/130799,intel-goes-32nm.aspx