Huawei is reportedly planning to expand its high-end HISilicon Kirin chipsets lineup with the launch of Kirin 9010 as a next-generation system-on-chip (SoC).

The upcoming Huawei P70 series will use a new chipset from HiSilicon tentatively named “Kirin 9010”, writes Smart Pikachu on Weibo. The chip hasn’t been officially announced yet, but it has ...

A Chinese state report assessing CPU reliability and security has revealed the HiSilicon Kirin X90, a never-before-seen SoC ...

HiSilicon’s Taishan CPU cores may be used here, for the top two clusters, ... around 30% more powerful than the Kirin 9010. We still don’t know what architecture was used to make this chip.

Huawei subsidiary HiSilicon designed the Kirin 9010 chip from the Pura 70 Pro; it was mass-produced by Semiconductor Manufacturing International Corp. (SMIC), a major Chinese contract chipmaker.

The Kirin 9010, for instance, had a 1+3+4 physical core layout, but its prime and mid-range cores support hyperthreading. This makes its logical core design 2+6+4. The Kirin 9020 also likely uses ...

The previous Kirin 9010 used a 1+3+4 configuration with hyperthreading on the big and mid cores. The small ones didn’t use the tech. ... HiSilicon Huawei Kirin 9020 Maleoon 920 Mate 70.

The Kirin 9010’s CPU cores are limited to 2,30GHz, while the Kirin 9000S was limited to 2.62GHz. The thing is, this one has more cores, as already mentioned, and it should be faster overall.

Huawei is reportedly planning to expand its high-end HISilicon Kirin chipsets lineup with the launch of Kirin 9010 as a next-generation system-on-chip (SoC). Huawei Consumer Business Group CEO ...

HiSilicon’s Taishan CPU cores may be used here, for the top two clusters, ... around 30% more powerful than the Kirin 9010. We still don’t know what architecture was used to make this chip.